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USB 3.0 FDM for Industrial and Embedded Applications
The new USB 3.0 FDM features a 20-pin DIP configuration, now appearing on many new motherboards, and is available in capacities of 8GB to 32GB.

PCIe FDM for Industrial and Embedded Applications
The new PCIe FDM features a PCIe x1 interface, perfect for mini-ITX embedded projects and Industrial designs. Unlike USB 3.0, the PCIe currently supports booting.

Dual & Quad Rank Quad-Chanel DDR3 RDIMMs
Every kit is tuned for optimum performance and is hand tested in an X79 motherboard to ensure that it will meet your expectations.

Ultra-portable USB 3.0 SSD, the Storage POD mini
The new USB 3.0 Storage POD mini enables an external SSD to function faster than the internal hard drive.

The fastest 2.5” SSD to date, the SATA3 TeraNova.
Featuring the SATA3 Interface and SandForce 2200 processor with optimized firmware, the SuperTalent TeraNova was built for speed.